The mil std 188 series is subdivided into a mil std 188100 series, covering common standards for. Unless otherwise specified, for conditions a, c, and d, the sample size number specified. The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the applicable acquisition document. The main changes that will effect dod labeling are exterior marking and msl, labeling serialized and uid product, formatting the pdf417 barcode. Eliminate redundancy and inconsistency with other contract specifications and standards. Milstd22 has been redesignated as a design criteria. Mil prf38534 hybrid microcircuits, general specification for. The mil standard on this page describes the procedure in technical language. Figure 2 illustrates the minimum information needed to ship our customers orders. This military standard is approved for use by all departments and agencies of the department of defense. Mil std 883, or invoke it in its entirety as the applicable standard see 1. Copies of the ntia manual are available from the u. This document is applicable to the protection of electrical and electronic parts, assemblies and equipment from damage due to esd.
Milstd202 test methods for electronic and electrical component parts. An analytical balance capable of weighing the devices accurately to 0. Program in accordance with the requirements of mil std 1686. The following group tests are used for qualifications or quality conformance inspections of semiconductor products used for military purposes. Military standard 129r marking and shipping label requirements november 2014 3 november 2014 tcn is the key element in tracking fas distribution operation shipments and must appear on the shipping label with in the clear text and barcode information. Mil stds in the 188 series mil std 188xxx address telecommunication design parameters based on proven technologies.
For manual measurements, the sequence of parameter measurements shall be. The milstd883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations. Keystone compliance assists manufacturers with milstd833 compliance. Wire break at neckdown point reduction of cross section due to bonding process. Mil std 129p may be the beginning of a convergence of mil std 129 labeling of packaging and mil std labeling of items.
Data retention value 10,000 1,000 10 units cyclesbyte years c ondition milstd 833 test method 1033 milstd 833 test method 1008 dc characteristics symbol cc ub, 30. Beneficial conmients recommendat ions, additions, deletions. These mil stds are to be used in all new dod systems and equipment, or major upgrades thereto, to ensure interoperability. The v 50 blp may be defined as the average of an equal number of highest partial penetration velocities and the lowest. This standard specifies a method of measuring the filtering capabilities of passive, lowpass. Mil std 883 establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations. For additional guidance on the contents of this document, contact the commanding. This revision has resulted in numerous changes to mil std 129 revision p, change 4, but the most significant ones are. Mil std 883 test method standard for microcircuits mil std 883 has no government s and written with the expressed intention of being emulated and expressed exactly asis, and as singular reference mil prf19500 semiconductor devices, general specification for. The cover page has been changed for administrative reasons. Milstd814 requirements for tiedown, suspension and extraction provisions on military material for airdrop. These filters also meet ce102 and cs101 of milstd461d, e and f. Pd 150 c 25 c 833 c w 150 milliwatts the 833 c w for the sot553 package assumes the use of the recommended footprint on a glass epoxy.
Milstd22d 25 nay 1919 forewoild thie standard contains scru. Custom monolithic, nonjan multichip and all other nonjan microcircuits except nonjan hybrids described or implied to be compliant with methods 5004 and. Subgroup class levels test milstd883 quantity accept number reference paragraph s b method condition 1 x x physical dimensions 2016 15 0 3. The milstd883 standard establishes uniform methods, controls, and procedures for testing. If a single twodimension pdf417 bar code cannot accommodate all the information for the included item information, a set of macro pdf417 bar codes can be used to encode the. Custom monolithic, nonjan multichip and all other nonjan microcircuits except nonjan hybrids described or implied to be compliant with methods 5004 and 5005 or 5010 of mil std 883 are required to meet all of the non. When amendment, revision, or cancellation of this standard is proposed which. Milstd883e, test method standard for microcircuits scipp. Reliability test methods, plans, and environments for engineering. Milstd883, or invoke it in its entirety as the applicable standard see 1. Mil std 883 class b or class s, any exceptions taken to the requirements of the referenced quality level i. Ensure maintenance and repair is performed only by qualified personnel on dodowned containers. This standard provides a basis and a uniform method for specifying product cleanliness levels and contamination control program requirements. Section modulus is defined as bh 2 6 width x thickness 2 6 for rectangular leads, and 0.
New contracts, and any device types classified as compliant to milstd883 after. Test methods for electrical connectors superseding milstd44 keywords. This standard is approved for use by all departments and agencies of the department of defense dod. Milstd833 minimization of hazards of electromagnetic. This standard is approved for use by all departments and agencies of the department of defense. Download military handbooks milhdbk and standards milstd. Milstd1627 has been redesignated as a design criteria. Details and decision logic for the use of this standard are described in 1. Milstd883 method 5005 quality conformance inspection qci group tests. Feb 22, 2005 rr c 271 chains and attachments, welded and weldless standards department of defense milstd9 requirements for the certification of sling loaded military equipment for external transportation by department of defense helicopters. Comment, suggestions, or questions on this document should be addressed to.
Custom monolithic, nonjan multichip and all other nonjan microcircuits except nonjan hybrids described or implied to be compliant with methods 5004 and 5005 or 5010 of milstd883 are required to meet all of the non. Most are familiar with mil std 883 tests such as temp cycle tm 1010 or burnin tm 1015. Milstd7504 electrical characteristics tests for diodes, microwave diodes, thyristors, and tunnel diodes. Milstd44a test methods for electrical connectors superseding mi x 7tcbz c author. How to test bonds wire pull appendices milstd883 method 2011. Definition of terms for reliability and maintainability revision c. Milstd7505 high reliability space application test methods for semiconductor devices. A vacuumpressure chamber for the evacuation and subsequent pressure bombing of devices up to 90 psia up to 10 hours. The objective of this guide is to establish the applications and limitations of tailoring milstd1521. New release of milstd883 visual inspection criteria tj. To detect the presence of moisture trapped inside a device package that may affect device parameters, i. The emphasis is on contaminants that cause damage through physical interactions rather than chemical interactions.
Our lead integrity test type page illustrates the test conditions a, b 1, b 2, c 1, c 2 and d with real examples. Uses an equipment that can expose the device to the specified high temp down to 65 deg c while measuring affected parameters. Mil std 833 minimization of hazards of electromagnetic radiation of electroexplosive devices superseded by mil std 1512. This standard covers the procedure for establishing ammunition color coding. Data retention value 10,000 1,000 10 units cyclesbyte years c ondition mil std 833 test method 1033 mil std 833 test method 1008 dc characteristics symbol cc ub, 30.
Milstd7503 electrical characteristics tests for bipolar, mosfet, and gallium arsenide transistors. Quick manual testing of thin wire auto hook dvs 2811 triangulation. Ensure all inspections are accomplished iaw milstd3037 for recertification and attach all inspection documentation in jcm see appendix a. Department of defense compliance with military labeling. Milstd662f 4 other methods attempt to approximate the v 100 point, that is, the minimum velocity at which all projectiles will completely penetrate. Milstd120 12 december 1950 munitions board standard agency department of defense washington, d. Mil std 883 testing in a full service lab with three shakers, several temphumidity chambers, shock. Inchpound milstd209k 22 february 2005 superseding milstd.
This standard has been approved by the departments of the army, the navy, and the air force for the purpose of establishing uniform practices. Intermodal container inspection, reinspection, maintenance. Specific reference to one or more mil std 883 methods on a standalone basis requires compliance to only the specifically. Milstd1627 has been redesignated as a design criteria standard. This milltary standard is approved for use by all departments and agencies of thedepartment of defense.
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